Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching
- Publication Type:
- Journal Article
- Citation:
- Langmuir, 2011, 27 (2), pp. 809 - 814
- Issue Date:
- 2011-01-18
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| la1045354.pdf | Published Version | 2.49 MB |
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We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°. © 2010 American Chemical Society.
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