A Fully Integrated Conductive and Dielectric Additive Manufacturing Technology for Microwave Circuits and Antennas

Li, M; Yang, Y; Zhang, Y; Iacopi, F; Ram, S; Nulman, J

A Fully Integrated Conductive and Dielectric Additive Manufacturing Technology for Microwave Circuits and Antennas

Li, M Yang, Y

Zhang, Y Iacopi, F

Ram, S Nulman, J

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Publisher:: IEEE
Publication Type:: Conference Proceeding
Citation:: 2020 50th European Microwave Conference, EuMC 2020, 2021, 00, pp. 392-395
Issue Date:: 2021-01-12

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Field	Value	Language
dc.contributor.author	Li, M
dc.contributor.author	Yang, Y https://orcid.org/0000-0001-7439-2156
dc.contributor.author	Zhang, Y
dc.contributor.author	Iacopi, F https://orcid.org/0000-0002-3196-0990
dc.contributor.author	Ram, S
dc.contributor.author	Nulman, J
dc.date	2021-01-12
dc.date.accessioned	2021-03-29T02:03:43Z
dc.date.available	2021-03-29T02:03:43Z
dc.date.issued	2021-01-12
dc.identifier.citation	2020 50th European Microwave Conference, EuMC 2020, 2021, 00, pp. 392-395
dc.identifier.isbn	9782874870590
dc.identifier.uri	http://hdl.handle.net/10453/147604
dc.description.abstract	© 2021 EuMA. A fully-integrated additive manufacturing (AM) approach for microwave devices is presented in this work. The applied AM technology can print the circuit models simultaneously with conductive and dielectric materials. Taking advantage of this one-stop 3D manufacturing technology, multilayer circuit board with vias or holes can be prototyped rapidly and precisely. The electrical properties of the dielectric ink material are measured up to 40 GHz using a quasi-optical cavity test system. To further demonstrate the merit of this technology, an infilled-ground transmission line, as well as a microstrip patch antenna, are designed and fabricated. For proof-of-concept, the return loss, gain and radiation patterns of the antenna are measured, which demonstrate a good agreement with the simulated results.
dc.language	en
dc.publisher	IEEE
dc.relation	NanoDimension
dc.relation.ispartof	2020 50th European Microwave Conference, EuMC 2020
dc.relation.ispartof	2020 50th European Microwave Conference (EuMC)
dc.relation.isbasedon	10.23919/EuMC48046.2021.9338141
dc.rights	© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.	en_US
dc.rights	info:eu-repo/semantics/openAccess
dc.title	A Fully Integrated Conductive and Dielectric Additive Manufacturing Technology for Microwave Circuits and Antennas
dc.type	Conference Proceeding
utslib.citation.volume	00
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	open_access	*
dc.date.updated	2021-03-29T02:03:42Z
pubs.finish-date	2021-01-14
pubs.publication-status	Published
pubs.start-date	2021-01-12
pubs.volume	00

Abstract:

© 2021 EuMA. A fully-integrated additive manufacturing (AM) approach for microwave devices is presented in this work. The applied AM technology can print the circuit models simultaneously with conductive and dielectric materials. Taking advantage of this one-stop 3D manufacturing technology, multilayer circuit board with vias or holes can be prototyped rapidly and precisely. The electrical properties of the dielectric ink material are measured up to 40 GHz using a quasi-optical cavity test system. To further demonstrate the merit of this technology, an infilled-ground transmission line, as well as a microstrip patch antenna, are designed and fabricated. For proof-of-concept, the return loss, gain and radiation patterns of the antenna are measured, which demonstrate a good agreement with the simulated results.

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http://hdl.handle.net/10453/147604