Two-Dimensional Equivalent Circuit Model of Ultrasonic Wireless Power Transmission

Du, Y Zhao, Y Wang, Z Wang, H Wang, J Geng, Y Sun, L

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Publisher:: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Publication Type:: Journal Article
Citation:: IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2023, 70, (1), pp. 975-984
Issue Date:: 2023-01

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Field	Value	Language
dc.contributor.author	Du, Y
dc.contributor.author	Zhao, Y
dc.contributor.author	Wang, Z
dc.contributor.author	Wang, H
dc.contributor.author	Wang, J
dc.contributor.author	Geng, Y
dc.contributor.author	Sun, L
dc.date.accessioned	2024-05-13T01:45:09Z
dc.date.available	2024-05-13T01:45:09Z
dc.date.issued	2023-01
dc.identifier.citation	IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2023, 70, (1), pp. 975-984
dc.identifier.issn	0278-0046
dc.identifier.issn	1557-9948
dc.identifier.uri	http://hdl.handle.net/10453/178875
dc.language	English
dc.publisher	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.relation.ispartof	IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
dc.relation.isbasedon	10.1109/TIE.2022.3152023
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject	08 Information and Computing Sciences, 09 Engineering
dc.subject.classification	Electrical & Electronic Engineering
dc.subject.classification	40 Engineering
dc.subject.classification	46 Information and computing sciences
dc.title	Two-Dimensional Equivalent Circuit Model of Ultrasonic Wireless Power Transmission
dc.type	Journal Article
utslib.citation.volume	70
utslib.for	08 Information and Computing Sciences
utslib.for	09 Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2024-05-13T01:45:07Z
pubs.issue	1
pubs.publication-status	Published
pubs.volume	70
utslib.citation.issue	1

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