3-D Printed Multi-Layer Low-Profile Coupler based on Vertically Integrated CRLH Transmission Line

Li, M; He, J; Yang, Y; Lian, J; Li, MM; Ding, D

3-D Printed Multi-Layer Low-Profile Coupler based on Vertically Integrated CRLH Transmission Line

Li, M He, J Yang, Y

Lian, J Li, MM Ding, D

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Publisher:: Institute of Electrical and Electronics Engineers (IEEE)
Publication Type:: Conference Proceeding
Citation:: 2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024, 2024, pp. 1-3
Issue Date:: 2024-01-01

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Full metadata record

Field	Value	Language
dc.contributor.author	Li, M
dc.contributor.author	He, J
dc.contributor.author	Yang, Y https://orcid.org/0000-0001-7439-2156
dc.contributor.author	Lian, J
dc.contributor.author	Li, MM
dc.contributor.author	Ding, D
dc.date	2024-11-27
dc.date.accessioned	2025-05-02T11:10:09Z
dc.date.available	2025-05-02T11:10:09Z
dc.date.issued	2024-01-01
dc.identifier.citation	2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024, 2024, pp. 1-3
dc.identifier.issn	2995-1984
dc.identifier.uri	http://hdl.handle.net/10453/187173
dc.description.abstract	This paper demonstrates several low-profile multilayer electronics fabricated using a novel 3D printing technology. This novel 3D printing technology can fabricate multilayer models with conductive and dielectric materials. In order to reduce the insertion loss and dimension of the electronics, a vertically integrated composite right/left handed (VI-CRLH) transmission line is proposed. And VI-CRLH couplers with good performance are design.
dc.language	en
dc.publisher	Institute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartof	2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024
dc.relation.ispartof	2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)
dc.relation.isbasedon	10.1109/MAPE62875.2024.10924468
dc.rights	info:eu-repo/semantics/restrictedAccess
dc.title	3-D Printed Multi-Layer Low-Profile Coupler based on Vertically Integrated CRLH Transmission Line
dc.type	Conference Proceeding
pubs.organisational-group	University of Technology Sydney
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	recently_added	*
dc.date.updated	2025-05-02T11:10:07Z
pubs.finish-date	2024-11-30
pubs.publication-status	Published
pubs.start-date	2024-11-27

Abstract:

This paper demonstrates several low-profile multilayer electronics fabricated using a novel 3D printing technology. This novel 3D printing technology can fabricate multilayer models with conductive and dielectric materials. In order to reduce the insertion loss and dimension of the electronics, a vertically integrated composite right/left handed (VI-CRLH) transmission line is proposed. And VI-CRLH couplers with good performance are design.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/187173